AJ Hamlin, Michigan Technological University; Jean-Celeste M. Kampe, Michigan Technological University; Amy E. Monte, Michigan Technological University; Brett Hamlin, Michigan Technological University; Douglas E. Oppliger, Michigan Technological University
Noel E. Bormann P.E., Gonzaga University; Mara London, Gonzaga University; Andrew Douglas Matsumoto, Gonzaga University; Melanie Ruth Walter; Spencer Joseph Fry
Jason Feser, American Association for the Advancement of Science, Science & Technology Policy ; Maura J. Borrego, National Science Foundation; Russ Pimmel, University of Alabama; Connie Kubo DUPE Della-Piana, National Science Foundation
Peter H. Meckl, Purdue University; Marc H. Williams, Purdue University, West Lafayette; Carolyn Percifield, Purdue University; Monica E. Cardella, Purdue University, West Lafayette; Michael T. Harris, Purdue University, West Lafayette; Leah H. Jamieson, Purdue University, West Lafayette
Technology Integration in Manufacturing Curriculum
Collection
2024 ASEE Annual Conference & Exposition
Authors
Krzysztof Kamil Jarosz, Rochester Institute of Technology; Yan-Ting Chen, Rochester Institute of Technology; Trisha Gard-Thompson, Rochester Institute of Technology; Mark Davis, Rochester Institute of Technology; Yunbo Zhang, Rochester Institute of Technology; Rui Liu, Rochester Institute of Technology
Henry Louie, Seattle University; Pritpal Singh, Villanova University; Susan M. Lord, University of San Diego; Scarleth Vanessa Vasconcelos, Villanova University
Tagged Divisions
Electrical and Computer Engineering Division (ECE)
Saharnaz Baghdadchi, University of California, San Diego; Curt Schurgers, University of California, San Diego; Huihui Qi, University of California, San Diego; Hamad Alajeel, University of California, San Diego
Tagged Divisions
Electrical and Computer Engineering Division (ECE)