Yongming Tang, Southeast University; Jiahua Lu, Xilinx; Yanfang Deng, Nanjing Integrated Circuits Industry Service Center; Susan M. Lord, University of San Diego
Candace Rose Wiwel, University of Michigan; Jessica E. S. Swenson, University of Michigan; Magel P. Su, University of Michigan; Max William Blackburn, University of Michigan; Aaron W. Johnson, University of Michigan; Cynthia J. Finelli, University of Michigan
Marguerite Anne Tuer-Sipos, University of Toronto; Stephen Manion, University of Toronto; Yasaman Delaviz, University of Toronto; Scott D. Ramsay, University of Toronto
Nancy Romance, Florida Atlantic University; Ali Zilouchian, Florida Atlantic University; Michael Vitale, East Carolina University; Lisa Greenberg, Florida Atlantic University
Monika Ingalls; Elizabeth Hill, University of Minnesota Duluth; Helene Finger P.E., California Polytechnic State University, San Luis Obispo; Marca J. Lam, Rochester Institute of Technology (COE); Gloria Guohua Ma, Wentworth Institute of Technology; Diane L. Peters, Kettering University; Stephanie G. Wettstein, Montana State University, Montana Engineering Education Research Center; Deborah S. Won, California State University, Los Angeles; Claudia Mara Dias Wilson, New Mexico Institute of Mining and Technology; Cheyenne Florenia Rivera; Emily Silva, California State University, Los Angeles; Tara Sundsted, Montana State University, Bozeman
Xiao Zhang, University of Illinois, Urbana-Champaign; Andre Schleife, University of Illinois, Urbana-Champaign; Andrew Ferguson, University of Illinois, Urbana-Champaign; Pascal Bellon, University of Illinois, Urbana-Champaign; Timothy Bretl, University of Illinois, Urbana-Champaign; Geoffrey L. Herman, University of Illinois, Urbana-Champaign; Jessica A. Krogstad, University of Illinois, Urbana-Champaign; Robert Maass, University of Illinois, Urbana-Champaign; Cecilia Leal, University of Illinois, Urbana-Champaign; Dallas R. Trinkle , University of Illinois, Urbana-Champaign; Jian Ku Shang, University of Illinois, Urbana-Champaign; Matthew West, University of Illinois, Urbana-Champaign
Sandra Nite, Texas A&M University; G. Donald Allen, Texas A&M University; Ali Bicer, Texas A&M University; Jim Morgan, Charles Sturt University; Vanessa Mae Warren, Texas A&M University; Luciana Barroso, Texas A&M University
Alina Kononov, University of Illinois, Urbana-Champaign; Pascal Bellon, University of Illinois, Urbana-Champaign; Timothy Bretl, University of Illinois, Urbana-Champaign; Andrew L. Ferguson, University of Illinois, Urbana-Champaign; Geoffrey L Herman, University of Illinois, Urbana-Champaign; Kristopher Alan Kilian, University of Illinois, Urbana-Champaign; Jessica A. Krogstad, University of Illinois, Urbana-Champaign, Department of Materials Science and Engineering; Cecilia Leal, University of Illinois, Urbana-Champaign; Robert Maass, University of Illinois, Urbana-Champaign, Department of Materials Science and Engineering; Andre Schleife, University of Illinois, Urbana-Champaign, Department of Materials Science and Engineering; Jian Ku Shang, University of Illinois, Urbana-Champaign; Dallas R. Trinkle , University of Illinois, Urbana-Champaign; Matthew West, University of Illinois, Urbana-Champaign
Asad Yousuf, Savannah State University; Mohamad A. Mustafa, Savannah State University; Alberto G. De La Cruz; Alfredo Villanueva; Mir M. Hayder, Savannah State University