Yi Cheng, California State Polytechnic University-Pomona; Kathleen Hayden, California State Polytechnic University-Pomona; Zekeriya Aliyazicioglu, California State Polytechnic University-Pomona
Joe Tranquillo, Bucknell University; Donna Ebenstein, Bucknell University; James Baish, Bucknell University; William King, Bucknell University; Daniel Cavanagh, Bucknell University
James D. Sweeney, Florida Gulf Coast University; Kristine R. Csavina, Arizona State University, Polytechnic campus; Lisa Zidek, Florida Gulf Coast University
Lisa Huettel, Duke University; Kip Coonley, Duke University; Michael Gustafson, Duke University; Jungsang Kim, Duke University; Gary Ybarra, Duke University; Leslie Collins, Duke University
Douglas Williams, Georgia Institute of Technology; Robert Butera, Georgia Institute of Technology; Selcuk Uluagac, Georgia Institute of Technology; Matthew Clark, Georgia Institute of Technology; Andy Deck, National Instruments; Michael Torba, National Instruments; Steven Trahan, National Instruments
James Friauf, Milwaukee School of Engineering; Stephen Williams, Milwaukee School of Engineering; Steven Reyer, Milwaukee School of Engineering; Owe Petersen, Milwaukee School of Engineering
Jin-Hwan Lee, University of Cincinnati; Ali Asgar Bhagat, University of Cincinnati; Karen Davis, University of Cincinnati; Ian Papautsky, University of Cincinnati
Judy Cezeaux, Western New England College; Thomas Keyser, Western New England College; Eric Haffner, Western New England College; Anne Kaboray, Goodwill Industries of the Springfield/Hartford Area, Inc.; Carol Hasenjager, Goodwill Industries of the Springfield/Hartford Area, Inc.
Jeffrey Johnson, University of Cincinnati / Engineering; Mary Beth Privitera, University of Cincinnati; Daria Narmoneva, University of Cincinnati; Balakrishna Haridas, University of Cincinnati
Mihaela Radu, Rose-Hulman Institute of Technology; Clint Cole, Washington State University, Pullman; Mircea Alexandru Dabacan, Technical University of Cluj-Napoca, Romania; Shannon Sexton, Rose Hulman Institute of Technology
Mihaela Radu, Rose-Hulman Institute of Technology; Clint COLE, Washington State University, Pullman; Mircea Dabacan, Technical University of Cluj Napoca, Romania; Joe Harris, DigilentInc; Albert Fazekas, Technical University of Cluj Napoca, Romania; Ioana DABACAN, Technical University of Cluj Napoca, Romania
Kay C. Dee, Rose-Hulman Institute of Technology; Patricia Brackin P.E., Rose-Hulman Institute of Technology; Anneliese Watt, Rose-Hulman Institute of Technology; Alan Chiu, Rose-Hulman Institute of Technology; Glen A. Livesay, Rose-Hulman Institute of Technology; Jay Patrick McCormack, Rose-Hulman Institute of Technology; Renee D. Rogge, Rose-Hulman Institute of Technology; Richard A. House, Rose-Hulman Institute of Technology