Brian Iezzi, University of Michigan; Paul Chao, University of Michigan; Kyle Bushick, University of Michigan; Joshua Cooper, University of Michigan; Tathya Shinde, University of Michigan; Timothy Chambers, University of Michigan; Duncan Greeley, University of Michigan
Breejha Quezada, Purdue Engineering Education; Emily Haluschak, Purdue University at West Lafayette (COE); Aileen Ryan, Purdue University at West Lafayette (COE); Katherine Schieltz; Congying Wang, Purdue University at West Lafayette (COE); Amanda Johnston, California Polytechnic State University, San Luis Obispo; Alejandro Strachan, Purdue University at West Lafayette (COE); Tamara Moore, Purdue University at West Lafayette (COE)
Cyril Okhio, Clark Atlanta University; Austin Asgill, Kennesaw State University; Theodore Grosch, Kennesaw State University; Lakshmi Bhargavi Tripuraneni, Kennesaw State University; Mark Easley, Texas Instruments, Inc.
Jutshi Agarwal, University of Cincinnati; Samieh Askarian, University of Cincinnati; Gregory Bucks, University of Cincinnati; Teri Murphy, University of Cincinnati
Benjamin Chambers, Virginia Polytechnic Institute and State University; Stephen Moyer, Virginia Polytechnic Institute and State University; David Gray, Virginia Polytechnic Institute and State University; Po-Jen Shih, Virginia Polytechnic Institute and State University; Matthew James, Virginia Polytechnic Institute and State University
Sandra Clavijo, Stevens Institute of Technology (School of Engineering and Science); Louis Oh, Stevens Institute of Technology (School of Engineering and Science); Kishore Pochiraju, Stevens Institute of Technology (School of Engineering and Science)
Danilo Leal, Universidad Andres Bello, Vina del Mar, Chile; Genaro Zavala, Tecnologico de Monterrey, Monterrey, Mexico Universidad Andres Bello, Santiago, Chile